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MIJING Z21 MAX CPU Reballing Stencil Station For iPhone Android BGA Reballing Platform Temperature range: 50℃~350℃

SKU 82922299221
4.6
USD40.59 USD88.59 Stall rate

Pay in 4 interest-free payments of $10.15 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 11 - Sep 16

Description

Temperature range: 50℃~350℃

C105-103 x1

Strong compressive and quick repair of micro-fingerprint

Separating area 7 inches

Applicable Many types of metals materials: Gold

MIJING Z21 MAX CPU Reballing Stencil Station For iPhone Android BGA Reballing Platform Temperature range: 50℃~350℃MIJING Z21 MAX chip tin station CPU reballing stencil platform for iPhone 6 17 Pro Max A8 A19 Pro CPU, Android Phones. MJ Z21 MAX CPU IC tin planting platform with stell mesh for iPhone Android CPU repair. MIJING Z21 MAX CPU reballing stencil platform for iPhone A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 CPU, Android Huawei Qualcomm,ect. Applicable Model: 1. For iPhone 6 16 Pro Max CPU (A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 CPU). 2. For

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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