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Amaoe 31 IN 1 Middle Layer Reballing Stencil Kits for iPhone X-17 Series PHONEFIX the clamp can not only

SKU 60386315665
4.0
USD55.99 USD89.99 Stall rate

Pay in 4 interest-free payments of $14.00 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 11 - Sep 16

Description

the clamp can not only fix the motherboard but also the CPU/hard drive and other precision ICs without glue

5 megapixels and 3840*2160 resolution

Default frame rate of this camera is 15fps

circuit boards

put the motherboard into the baseband chip reading and writing area

Amaoe 31 IN 1 Middle Layer Reballing Stencil Kits for iPhone X-17 Series PHONEFIX the clamp can not onlyAmaoe 31 in 1 X 17 middle layer reballing platform with mid frame stencil steel mesh for iPhone X 17 Pro Max motherboard layering soldering repair. Amaoe iPhone motherboard middle layer frame tin planting station for iPhone X 11 12 13 14 15 16 17 Pro Max. Option(0. 12mm): 1. 31 in 1 set: 31 IN 1 middle layer reballing platform for iPhone X 17 Pro Max (not include the iPhone 16e 17air). 2. 6 in 1 set: 6 in 1 middle layer reballing platform for iPhone X

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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